Semiconductor Supply Chain Targets New Markets in Central and Eastern Europe
From August 22 to August 27, the Eastbound Alliance (TeaLa) led a delegation of member companies to the Czech Republic, featuring businesses in the semiconductor, AI, biotech, and digital security industries. During this visit, TeaLa signed two significant Memorandums of Understanding (MOUs). The first was signed with the Technology Park Brno, the Czech National Semiconductor Cluster, and the Taiwan Chamber of Commerce in the Czech Republic. The second MOU was signed with the Innovation Centre of the Usti Region, the Czech National Semiconductor Cluster, and the Taiwan Chamber of Commerce in the Czech Republic. These agreements aim to foster collaboration between Taiwan and the Czech Republic.
Under the coordination of TeaLa, further partnerships were established between two member companies and Czech semiconductor leader Onsemi, as well as high-power laser research institute HiLase. These partnerships will focus on joint projects that further enhance collaboration and innovation between Taiwan and the Czech Republic in the semiconductor and laser technology sectors. This visit not only facilitated cooperation between Taiwanese enterprises and key Czech technology institutions but also laid a solid foundation for future technological exchanges and industry development.
Following the International Semicon Exhibition, a Poland-Taiwan Business Forum was co-organized with the Polish Investment and Trade Agency, and an MOU was signed with Semicon Supply Poland to help link the Taiwanese and Polish semiconductor supply chains.
In mid-October, a delegation led by Secretary-General Allen Zheng will make another trip to the Czech Republic. Interested member companies are encouraged to contact the Secretariat to join the delegation and explore international markets together!
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